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NSR01F30NXT5G Schottky Barrier Diode
These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 (Dual Silicon No-lead) package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN style package enables 100% utilization of the package area for active silicon, offering a significant performance per board area advantage compared to products in plastic molded packages. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.
Features
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30 V SCHOTTKY BARRIER DIODE
1 CATHODE 2 ANODE
* * * * * * * * * * * * * * * * * *
Very Low Forward Voltage Drop - 370 mV @ 10 mA Low Reverse Current - 7.0 mA @ 10 V VR 100 mA of Continuous Forward Current ESD Rating - Human Body Model: Class 3B ESD Rating - Machine Model: Class C Very High Switching Speed Low Capacitance - CT = 7 pF This is a Halide-Free Device This is a Pb-Free Device
MARKING DIAGRAM
DSN2 (0201) CASE 152AA XXXX YYY PIN 1 XXXX YYY
Typical Applications
= Specific Device Code = Year Code
LCD and Keypad Backlighting Camera Photo Flash Buck and Boost dc-dc Converters Reverse Voltage and Current Protection Clamping & Protection
ORDERING INFORMATION
Device NSR01F30NXT5G Package Shipping
DSN2 5000 / Tape & Reel (Pb-Free)
Markets
Mobile Handsets MP3 Players Digital Camera and Camcorders Notebook PCs & PDAs GPS
Rating Symbol VR IF (60 Hz @ 1 cycle) IFSM ESD Value 30 100 4.0 8.0 400 Unit V mA A kV V
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
MAXIMUM RATINGS
Reverse Voltage Forward Current (DC) Forward Surge Current ESD Rating:
Human Body Model Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
(c) Semiconductor Components Industries, LLC, 2009
June, 2009 - Rev. 0
1
Publication Order Number: NSR01F30/D
NSR01F30NXT5G
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance Junction-to-Ambient (Note 1) Total Power Dissipation @ TA = 25C Thermal Resistance Junction-to-Ambient (Note 2) Total Power Dissipation @ TA = 25C Storage Temperature Range Junction Temperature Symbol RqJA PD RqJA PD Tstg TJ Min Typ Max 400 312 170 735 -40 to +125 +125 Unit C/W mW C/W mW C C
1. Mounted onto a 4 in square FR-4 board 10 mm sq. 1 oz. Cu 0.06" thick single sided. Operating to steady state. 2. Mounted onto a 4 in square FR-4 board 1 in sq. 1 oz. Cu 0.06" thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Reverse Leakage (VR = 10 V) (VR = 30 V) Forward Voltage (IF = 10 mA) (IF = 100 mA) Total Capacitance (VR = 5.0 V, f = 1 MHz) Symbol IR Min Typ Max 7.0 50 0.37 0.50 7.0 Unit mA
VF
V
CT
pF
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NSR01F30NXT5G
TYPICAL CHARACTERISTICS
100 IF, FORWARD CURRENT (mA) 10 150C 1 125C 75C 25C 0.01 -25C 1.0E+04 150C Ir, REVERSE CURRENT (mA) 1.0E+02 125C 75C 25C
1.0E+00
0.1
1.0E-02
-25C
0.001
0
0.1
0.2
0.3
0.4
0.5
0.6
1.0E-04
0
5
10
15
20
25
30
VF, FORWARD VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 1. Forward Voltage
20 CT, TOTAL CAPACITANCE (pF) 18 16 14 12 10 8 6 4 2 0 0 5 10 15 20 25
Figure 2. Leakage Current
TA = 25C
30
VR, REVERSE VOLTAGE (V)
Figure 3. Total Capacitance
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NSR01F30NXT5G
PACKAGE DIMENSIONS
DSN2, 0.6x0.3, 0.4P, (0201) CASE 152AA-01 ISSUE O
D A B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. DIM A A1 b D E e L MILLIMETERS MIN MAX 0.24 0.30 0.00 0.01 0.22 0.28 0.30 BSC 0.60 BSC 0.40 BSC 0.12 0.18
2X
0.06 C
2X
E
0.06 C TOP VIEW 0.05 C A
MOUNTING FOOTPRINT*
0.28 C
SEATING PLANE
2X
0.05 C
A1 SIDE VIEW e
0.75
1 2X
0.28
0.30
DIMENSIONS: MILLIMETERS
L
2
2X
b 0.05 C A B
See Application Note AND8398/D for more mounting details *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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NSR01F30/D

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